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T051 NTC Thermistor, Leadless Chip, Gold Contacts, Top and Bottom, Solder Leach Resistant, Predeposited Au80/Sn20 Solder on Bottom Contact Description: Leadless NTC thermistor chip with high temperature solder leach resistant gold contacts on top and bottom surfaces and predeposited Au80/Sn20 solder on bottom contact |
| Features: | |
| • | Patented top/bottom solder leach resistant gold contacts |
| • | R25 values from 5,000 Ω to 10,000 Ω |
| • | Point matched tolerances ± 10 % to ± 2 % |
| • | Suitable for mounting with Au80/Sn20 solder |
| • | Predeposited Gold 80/Tin 20 Predeposited Solder (Eutectic) enhances surface mount adhesion |
| • | Contact suitable for wirebonding |
| • | Variety of standard die sizes |
| • | Custom and semi-custom products may be specified |
Typical Part Numbers
| Part # | R/T Curve |
R25 (Ω) | Tolerance | Nominal Dimensions: in [mm] | ||
| Width | Length | Thickness | ||||
| T051D502.05.D | D | 5,000 | ± 5.0 % | 0.025 [0.64] | 0.025 [0.64] | 0.006 [0.15] |
| T051D502.02.D | D | 5,000 | ± 2.0 % | 0.025 [0.64] | 0.025 [0.64] | 0.006 [0.15] |
| T051D103.05.H | D | 10,000 | ± 5.0 % | 0.017 [0.43] | 0.017 [0.43] | 0.006 [0.15] |
| T051D103.02.H | D | 10,000 | ± 2.0 % | 0.017 [0.43] | 0.017 [0.43] | 0.006 [0.15] |
| T051D103.05.I | D | 10,000 | ± 5.0 % | 0.040 [1.02] | 0.040 [1.02] | 0.014 [0.36] |
| T051D103.02.I | D | 10,000 | ± 2.0 % | 0.040 [1.02] | 0.040 [1.02] | 0.014 [0.36] |
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Typical part numbers are listed above. Consult factory for parts available in other R25 Values and Tolerances. |
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