Product Information  > Leadless NTC Thermistor

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T000 Series Leadless Chip NTC Thermistors

Cornerstone Sensors Leadless NTC chip thermistors with top and bottom metalized surface contacts features and benefits: • Suitable for mounting on a variety of substrates. • Cornerstone Sensors superior chip thermistor technology. • Exceptional stability and reliability. • Die mount with either conductive epoxy or by soldering. • Suitable for gold wire bonding. • Four types metalization: thick film silver, thick film gold, leach-resistant gold [patented] and leach-resistant gold with pre-deposited solder [patented].

T010 Series NTC Thermistors T010 Series NTC Thermistors, Thick Film Silver The T010 Series leadless chip NTC thermistor features: • Top and bottom surface silver contacts. • Die mount with conductive epoxy or low temperature solders. • Suitable for wire bonding.

T020 Series NTC Thermistors T020 Series NTC Thermistors, Thick Film Gold The T020 Series leadless chip NTC thermistor features: • Top and bottom surface gold contacts. • Die mount with conductive epoxy or low temperature solders. • Suitable for wire bonding.

T040 Series NTC Thermistors T040 Series NTC Thermistors, High Temperature Solder Leach Resistant Gold The T040 Series leadless chip NTC thermistor features: • Top and bottom surface gold contacts. • Exceptional solder leach resistance. • Cornerstone Sensors' unique, patented metalization technology. • Superior thermistor processing technology. • Exceptional stability and reliability. • Can be die mounted with Au80/Sn20 eutetic solder. • Can handle rigorous die attach soldering processes at 350 °C to 380 °C • Suitable for wire bonding.

T050 Series NTC Thermistors T050 Series NTC Thermistors, High Temperature Solder Leach Resistant Gold with Pre-Deposited Solder The T050 Series leadless chip NTC thermistor features: • Top and bottom surface gold contacts. • Exceptional solder leach resistance. • Cornerstone Sensors' unique, patented metalization technology. • Superior thermistor processing technology. • Exceptional stability and reliability. • T051 Style can be die mounted with Au80/Sn20 eutetic solder. • Can handle rigorous die attach soldering processes up to 380 °C • T052 Style can be die mounted with Sn96.5/Ag3.5 eutetic solder. • Pre-deposited solder on one side. • Improves die bonding process, enhances die attach strength and reliability. • Suitable for wire bonding on top surface gold contact.