| Product Information (RoHS) > Leadless NTC Thermistor (RoHS) |
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| (RoHS) T000 Series Leadless Chip NTC Thermistors | ||||||||||
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Cornerstone Sensors' T000 Series Leadless NTC chip thermistors are considered RoHS compliant by virtue of Items 5 and 8 of the Directive Annex, which describes the exemptions from the requirements for lead and cadmium. For more information regarding the exemptions, please refer to Cornerstone Sensors, Inc. Statement Regarding RoHS Compliance.
Cornerstone Sensors Leadless NTC chip thermistors with top and bottom metalized surface contacts features and benefits: • Suitable for mounting on a variety of substrates. • Cornerstone Sensors superior chip thermistor technology. • Exceptional stability and reliability. • Die mount with either conductive epoxy or by soldering. • Suitable for gold wire bonding. • Four types metalization: thick film silver, thick film gold, leach-resistant gold [patented] and leach-resistant gold with pre-deposited solder [patented]. | ||||||||||
The T010 Series leadless chip NTC thermistor features: • Top and bottom surface silver contacts. • Die mount with conductive epoxy or low temperature solders. • Suitable for wire bonding. | ||||||||||
The T020 Series leadless chip NTC thermistor features: • Top and bottom surface gold contacts. • Die mount with conductive epoxy or low temperature solders. • Suitable for wire bonding. | ||||||||||
The T040 Series leadless chip NTC thermistor features: • Top and bottom surface gold contacts. • Exceptional solder leach resistance. • Cornerstone Sensors' unique, patented metalization technology. • Superior thermistor processing technology. • Exceptional stability and reliability. • Can be die mounted with Au80/Sn20 eutetic solder. • Can handle rigorous die attach soldering processes at 350 °C to 380 °C • Suitable for wire bonding. | ||||||||||
The T050 Series leadless chip NTC thermistor features: • Top and bottom surface gold contacts. • Exceptional solder leach resistance. • Cornerstone Sensors' unique, patented metalization technology. • Superior thermistor processing technology. • Exceptional stability and reliability. • T051 Style can be die mounted with Au80/Sn20 eutetic solder. • Can handle rigorous die attach soldering processes up to 380 °C • T052 Style can be die mounted with Sn96.5/Ag3.5 eutetic solder. • Pre-deposited solder on one side. • Improves die bonding process, enhances die attach strength and reliability. • Suitable for wire bonding on top surface gold contact. |