• Top and bottom surface silver contacts.
• Suitable for mounting on a variety of substrates.
• Cornerstone Sensors superior chip thermistor technology.
• Exceptional stability and reliability.
• Die mount with either conductive epoxy or by low temperature soldering.
• Suitable for gold wire bonding.
• Typical die sizes range from 0.100 in x 0.140 in to 0.017 in x 0.017 in
• Available in most standard R/T Curve materials.
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Because they are uncoated, suitable protection must be provided for the thermistor against the effects of harsh environments during operation or storage.
Thermal time constants and dissipation constants are dependent upon the method of die mounting and the thermal properties of the substrate.
